JPH0121564Y2 - - Google Patents

Info

Publication number
JPH0121564Y2
JPH0121564Y2 JP549384U JP549384U JPH0121564Y2 JP H0121564 Y2 JPH0121564 Y2 JP H0121564Y2 JP 549384 U JP549384 U JP 549384U JP 549384 U JP549384 U JP 549384U JP H0121564 Y2 JPH0121564 Y2 JP H0121564Y2
Authority
JP
Japan
Prior art keywords
package
conductor pattern
chip
signal conductor
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP549384U
Other languages
English (en)
Japanese (ja)
Other versions
JPS60118242U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP549384U priority Critical patent/JPS60118242U/ja
Publication of JPS60118242U publication Critical patent/JPS60118242U/ja
Application granted granted Critical
Publication of JPH0121564Y2 publication Critical patent/JPH0121564Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP549384U 1984-01-19 1984-01-19 Ｉｃチツプ用パツケ−ジ Granted JPS60118242U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP549384U JPS60118242U (ja) 1984-01-19 1984-01-19 Ｉｃチツプ用パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP549384U JPS60118242U (ja) 1984-01-19 1984-01-19 Ｉｃチツプ用パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS60118242U JPS60118242U (ja) 1985-08-09
JPH0121564Y2 true JPH0121564Y2 (en]) 1989-06-27

Family

ID=30482047

Family Applications (1)

Application Number Title Priority Date Filing Date
JP549384U Granted JPS60118242U (ja) 1984-01-19 1984-01-19 Ｉｃチツプ用パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS60118242U (en])

Also Published As

Publication number Publication date
JPS60118242U (ja) 1985-08-09

Similar Documents

Publication Publication Date Title
US5235208A (en) Package for microwave integrated circuit
US5014115A (en) Coplanar waveguide semiconductor package
US5557144A (en) Plastic packages for microwave frequency applications
US5852391A (en) Microwave/millimeter-wave functional module package
JPH04137655A (ja) Ｉｃパッケージ
US6507110B1 (en) Microwave device and method for making same
JPH0629428A (ja) 半導体装置
US5901042A (en) Package and semiconductor device
US7211887B2 (en) connection arrangement for micro lead frame plastic packages
US5530285A (en) Low-impedance surface-mount device
JPH0121564Y2 (en])
JP3619396B2 (ja) 高周波用配線基板および接続構造
JPS6348129Y2 (en])
JPH0334911Y2 (en])
JP7666175B2 (ja) 半導体装置およびパッケージ
JP6952913B2 (ja) 半導体装置及びアンテナ装置
JPH0126109Y2 (en])
JPH03132101A (ja) 表面実装型半導体デバイスおよび方法
US20040227226A1 (en) Structure of multi-tier wire bonding for high frequency integrated circuits and method of layout for the same
JPH0427170Y2 (en])
JPS61184852A (ja) 集積回路パツケ−ジ
JPH04213863A (ja) Ｉｃ実装用パッケージ／キャリア
JPS61108152A (ja) Ｉｃチツプ用パツケ−ジ
JPH066512Y2 (ja) 集積回路パツケ−ジ
JP4127589B2 (ja) 高周波半導体装置用パッケージおよび高周波半導体装置